C172 Beryllium Copper Alloy Wire (CuBe2)

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Beryllium Copper alloys combine formability with very high strength properties when aged. Applications are in springs, connectors, switches and automotive parts. Special heat treating of the wire at the mill produces a “Mill Hardened” (HM) tempered Beryllium Copper wire which can then be formed and used without additional heat treatment.

Mechanical Properties

Round Wire

Temper Name  Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
Annealed (A) TB00 400 540 .0254 - 3.264 mm
1/4 Hard TD01 620 795
1/2 Hard TD02 760 930
3/4 Hard TD03 895 1070
Hard TD04 965 1140
AT TF00 1105 1380
1/4 HT TH01 1205 1450
1/2 HT TH02 1275 1480
3/4 HT TH03 1310 1585
HT TH04 1345 1585

Square Wire

Temper Name  Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
Annealed (A) TB00 400 540 .2540 - 1.905 mm
1/4 Hard TD01 620 795
1/2 Hard TD02 760 930
3/4 Hard TD03 895 1070
Hard TD04 965 1140
AT TF00 1105 1380
1/4 HT TH01 1205 1450
1/2 HT TH02 1275 1480
3/4 HT TH03 1310 1585
HT TH04 1345 1585

Rolled Flat

Temper Name  Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
Annealed (A) TB00 415 540

Thickness:
.2540 - 1.905 mm

Width:
.3810 - 6.350 mm

 

1/4 Hard TD01 515 605
1/2 Hard TD02 585 690
Hard TD03 690 895
AT TF00 1140 1345
1/4 HT TH01 1205 1415
1/2 HT TH02 1275 1480
HT TH03 1310 1515

Physical Properties

(1) Expressed as a range per CDA
Melting Point (Liquidis) 982°C
Melting Point (Solidus) 866°C
Minimum Solutionizing Temperature 788°C
Density 8.24871 gm/cu cm
Electrical Resistivity (Annealed) 7.6804 ?? -cm @ 20°C
Electrical Conductivity (Age Hardedned) 0.12879 MegaSiemens /cm @ 20°C
Thermal Conductivity (Solutionized-Aged) (1) 107-130 W/m · °K @ 20°C
Coefficient of Thermal Expansion 0.00001782°C (20-300°C)
Modulus of Elasticity (Tension) 127600 Mpa
Modulus of Rigidity 50300 Mpa