C7025 High Performance Alloy Wire (CuNi3Si1)

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Alloy C7025 is a High Performance Alloy that combines strength, conductivity, formability and stress relaxation resistance into a unique set of properties. C7025 has the qualities of some of the Beryllium Coppers without containing any Beryllium. The alloy is a thermally aged material. It achieves it’s properties by combinations of cold work and heat treatments, all of which is done at the mill. The alloy’s high strength and conductivity combined with its formability and stress relaxation properties make C7025 an excellent electronic alloy, particularly in high temperature environments.

Mechanical Properties

Round Wire

Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
TL02 550 690 .0254 - 3.264 mm
TL03 690 825
TR02 605 0
TM00 620 760
TM02 655 825
TM03 690 860

Square Wire

Temper Code Tensile Strength (N/mm²) Mill Limits
Min Max
TL02 550 690 .2540 - 1.905 mm
TL03 690 825
TR02 605 0
TM00 620 760
TM02 655 825
TM03 690 860

Physical Properties

Melting Point (Liquidis) 1095°C
Melting Point (Solidus) 1075°C
Density 8.80232 gm/cu cm
Electrical Resistivity (Annealed) 4.3057 ?? -cm @ 20°C
Electrical Conductivity (TM00 Temper) 0.23416668 MegaSiemens /cm @ 20°C
Electrical Conductivity (TM02 Temper) 0.23416668 MegaSiemens /cm @ 20°C
Electrical Conductivity (TM03 Temper) 0.23416668 MegaSiemens /cm @ 20°C
Electrical Conductivity (TR02 Temper) 0.204895845 MegaSiemens /cm @ 20°C
Thermal Conductivity (Solutionized-Aged) 168.8289474 W/m · °K @ 20°C
Modulus of Elasticity (Tension) 131000 MPa