C7025 High Performance Alloy Wire (CuNi3Si1)

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Alloy C7025 is a High Performance Alloy that combines strength, conductivity, formability and stress relaxation resistance into a unique set of properties. C7025 has the qualities of some of the Beryllium Coppers without containing any Beryllium. The alloy is a thermally aged material. It achieves it’s properties by combinations of cold work and heat treatments, all of which is done at the mill. The alloy’s high strength and conductivity combined with its formability and stress relaxation properties make C7025 an excellent electronic alloy, particularly in high temperature environments.

Mechanical Properties

Round Wire

Temper Code  Tensile Strength (ksi) Mill Limits 
Min Max
TL02 80 100 .0010 - .1285 inch
TL03 100 120
TR02 88  
TM00 90 110
TM02 95 120
TM03 100 125

Square Wire

Temper Code  Tensile Strength (ksi) Mill Limits 
Min Max
TL02 80 100 .0100 - .0808 inch
TL03 100 120
TR02 88  
TM00 90 110
TM02 95 120
TM03 100 125

Physical Properties

Melting Point (Liquidis) 2003°F
Melting Point (Solidus) 1967°F
Density 0.318 lbs/cu in
Electrical Resistivity (Annealed) 25.9 ?(cir mil/ft) @ 68°F
Electrical Conductivity (TM00 Temper) 40% IACS @ 68°F
Electrical Conductivity (TM02 Temper) 40% IACS @ 68°F
Electrical Conductivity (TM03 Temper) 40% IACS @ 68°F
Electrical Conductivity (TR02 Temper) 35% IACS @ 68°F
Thermal Conductivity (Solutionized-Aged) 97.5 Btu ft/sq ft hr °F @ 68°F
Modulus of Elasticity (Tension) 19000 ksi