C172 Beryllium Copper Alloy Wire (CuBe2)

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Beryllium Copper alloys combine form-ability with very high strength properties when aged. Applications are in springs, connectors, switches and automotive parts. Special heat treating of the wire at the mill produces a “Mill Hardened” (HM) tempered Beryllium Copper wire which can then be formed and used without additional heat treatment.

Mechanical Properties

Round Wire

Temper Name  Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
Annealed (A) TB00 400 540 .0254 - 3.264 mm
1/4 Hard TD01 620 795
1/2 Hard TD02 760 930
3/4 Hard TD03 895 1070
Hard TD04 965 1140
AT TF00 1105 1380
1/4 HT TH01 1205 1450
1/2 HT TH02 1275 1480
3/4 HT TH03 1310 1585
HT TH04 1345 1585

Square Wire

Temper Name  Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
Annealed (A) TB00 400 540 .2540 - 1.905 mm
1/4 Hard TD01 620 795
1/2 Hard TD02 760 930
3/4 Hard TD03 895 1070
Hard TD04 965 1140
AT TF00 1105 1380
1/4 HT TH01 1205 1450
1/2 HT TH02 1275 1480
3/4 HT TH03 1310 1585
HT TH04 1345 1585

Rolled Flat

Temper Name  Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
Annealed (A) TB00 415 540

Thickness:
.2540 - 1.905 mm

Width:
.3810 - 6.350 mm

 

1/4 Hard TD01 515 605
1/2 Hard TD02 585 690
Hard TD03 690 895
AT TF00 1140 1345
1/4 HT TH01 1205 1415
1/2 HT TH02 1275 1480
HT TH03 1310 1515

Physical Properties

(1) Expressed as a range per CDA
Melting Point (Liquidis) 982°C
Melting Point (Solidus) 866°C
Minimum Solutionizing Temperature 788°C
Density 8.24871 gm/cu cm
Electrical Resistivity (Annealed) 7.6804 ?? -cm @ 20°C
Electrical Conductivity (Age Hardedned) 0.12879 MegaSiemens /cm @ 20°C
Thermal Conductivity (Solutionized-Aged) (1) 107-130 W/m · °K @ 20°C
Coefficient of Thermal Expansion 0.00001782°C (20-300°C)
Modulus of Elasticity (Tension) 127600 Mpa
Modulus of Rigidity 50300 Mpa

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