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  • C102 Copper (Cu-OF)
  • C110 Copper (Cu-ETP)
  • C151 Zirconium Copper
  • C172 Beryllium Copper (CuBe2)
  • C17510 Copper-Nickel-Beryllium (CuNi2Be)
  • C18661 Copper-Magnesium (CMG1)
  • C19150/60 Leaded Precipitation-Hardenable Copper
  • C194 Copper-Iron (CuFe2P)
  • C197 High Performance Alloy
  • C260 Cartridge Brass (CuZn30)
  • C425 Copper-Zinc-Tin (CuSn3Zn9)
  • C510 Bronze (CuSn5)
  • C519 Phosphor Bronze 6% (CuSn6)
  • C521 Bronze (CuSn8)
  • C651 Silicon Bronze (CuSi1)
  • C70250 High Performance Alloy (CuNi3Si1)
  • C725 Copper-Nickel-Tin (CuNi9Sn2)
  • C752 Nickel Silver 18% (CuNi18Zn20)
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  • C102 Copper Alloy Wire (Cu-OF)

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    C102 is an oxygen-free copper which has better forming, resistance to hydrogen embrittlement, and brazing characteristics than C110 ETP. C102 has good solderability and corrosion resistance and is used for high current applications.

    Mechanical Properties

    Round Wire

    Temper Name Temper Code Tensile Strength (ksi) Mill Limits
    TYPICAL
    Annealed 0S050 35 .0010 - .1285 inch 
    Hard Drawn H04 60

    Square Wire

    Temper Name Temper Code Tensile Strength (ksi) Mill Limits
    TYPICAL
    Annealed 0S050 35 .0100 - .0808 inch 
    Hard Drawn H04 60

    Rolled Flat

    Temper Name Temper Code Tensile Strength (ksi) Mill Limits
    Min Max
    Annealed 0S050 26 38

    Thickness:
    .0100 - .0500 inch

    Width:
    .0150 - .2500 inch

    1/4 Hard H01 34 42
    1/2 Hard H02 37 46
    Hard H04 43 52
    Spring H08 50 58

    Physical Properties

    (1) Expressed as a range per CDA
    Melting Point (Liquidis) 1981°F
    Melting Point (Solidus) 1949°F
    Density (C102 Copper Alloy) 0.323/cu in 
    Density (C110 Copper Alloy) (1) .321-.323 lbs/cu in
    Electrical Resistivity (Annealed) 10.3 Ω⋅cmil/ft @ 68°F
    Electrical Conductivity (Annealed) 101 % IACS @ 68°F
    Coefficient of Thermal Expansion 0.0000098°F (68-572°F)
    Modulus of Elasticity (Tension) 17000 ksi
    Modulus of Rigidity 6400 ksi