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  • C102 Copper (Cu-OF)
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  • C18661 Copper-Magnesium (CMG1)
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  • C197 High Performance Alloy
  • C260 Cartridge Brass (CuZn30)
  • C425 Copper-Zinc-Tin (CuSn3Zn9)
  • C510 Bronze (CuSn5)
  • C519 Phosphor Bronze 6% (CuSn6)
  • C521 Bronze (CuSn8)
  • C651 Silicon Bronze (CuSi1)
  • C70250 High Performance Alloy (CuNi3Si1)
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  • C510 Bronze Alloy Wire (CuSn5)

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    Alloy C510 is an alloy with good strength, formability and stress relaxation characteristics and solderability. Applications include electronic parts, springs, switches, contacts and fasteners.

    Mechanical Properties

    Round Wire

    Temper Name  Temper Code  Tensile Strength (ksi) Mill Limits 
    Min Max
    Annealed   43 58 .0010 - .1285 inch
    1/4 Hard H01 60 76
    1/2 Hard H02 80 97
    3/4 Hard H03 96 115
    Hard H04 108 128
    Spring .025” & under H08 145  
    Over .025” to .0625” H08 135  
    Over .0625” to .125” H08 130  

    Square Wire

    Temper Name  Temper Code  Tensile Strength (ksi) Mill Limits 
    Min Max
    Annealed   43 58 .0100 - .0808 inch
    1/4 Hard H01 60 76
    1/2 Hard H02 80 97
    3/4 Hard H03 96 115
    Hard H04 108 128
    Spring: .025” & under H08 145  
    Over .025” to .0625” H08 135  
    Over .0625” to .125” H08 130  

    Rolled Flat

    Temper Name  Temper Code  Tensile Strength (ksi) Mill Limits 
    Min Max
    Annealed   43 58

    Thickness:
    .0100 - .0500 inch

    Width:
    .0150 - .2500 inch

    1/2 Hard H02 58 73
    Hard H04 76 91
    Extra Hard H06 88 103
    Spring H05 95 110

    Physical Properties

    Melting Point (Liquidis) 1920°F
    Melting Point (Solidus) 1750°F
    Density 0.32 lbs/cu in
    Electrical Resistivity (Annealed) 69.1 Ω⋅cmil/ft @ 68°F
    Electrical Conductivity (Annealed) 15% IACS @ 68°F
    Thermal Conductivity (Solutionized-Aged) 40 Btu ft/sq ft hr °F @ 68°F
    Coefficient of Thermal Expansion 0.0000099°F (68-572°F)
    Modulus of Elasticity (Tension) 16000 ksi
    Modulus of Rigidity 6000 ksi