Overview
As a low beryllium alloy, C17510 resides at the lower strength end of the beryllium copper strength spectrum but in comparison has a substantial increase in electrical conductivity. The alloy processes and heat-treats like all beryllium coppers and can also be provided in a (HM) “Mill Hardened” temper.
Physical Properties
Annealing Range (Min) | 1550 °F |
Annealing Range (Max) | 1700 °F |
Density | 0.317 lb/in³ |
Electrical Resistivity (Annealed) | 21.6 Ω·cir-mil/ft @ 68 °F |
Electrical Conductivity (Annealed) | 48% IACS @ 68 °F |
Thermal Conductivity | 120 Btu/ft²/ft·hr/°F @ 68 °F |
Coefficient of Thermal Expansion | 9.8 per °F (68-572 °F) |
Modulus of Elasticity (Tension) | 19 ksi |
Modulus of Rigidity (Tension) | 7 ksi |
Melting Point (Solidus) | 1,700 °F |
Melting Point (Liquidus) | 1,900 °F |
Round Wire
TEMPER NAME | TEMPER CODE | TENSILE STRENGTH (ksi) |
MILL LIMITS (inch) |
|
Min | Max | |||
Annealed | TB00 | 35.0 | 55.0 | .0010 - .1285 inch |
Hard | TD04 | 65.0 | 80.0 | |
AT | TF00 | 100 | 130 | |
HT | TH04 | 110 | 140 |
Square Wire
TEMPER NAME | TEMPER CODE | TENSILE STRENGTH (ksi) |
MILL LIMITS (inch) |
|
Min | Max | |||
Annealed | TB00 | 35.0 | 55.0 | .0100 - .0808 inch |
Hard | TD04 | 65.0 | 80.0 | |
AT | TF00 | 100 | 130 | |
HT | TH04 | 110 | 140 |
Rolled Flat
TEMPER NAME | TEMPER CODE | TENSILE STRENGTH (ksi) |
MILL LIMITS (inch) |
|
Min | Max | |||
Annealed | TB00 | 35.0 | 55.0 | Thickness: .0100 - .0500 inch Width: .0150 - .2500 inch |
1/2 Hard | TD02 | 60.0 | 75.0 | |
Hard | TD04 | 70.0 | 85.0 | |
AT | TF00 | 100 | 130 | |
1/2 HT | TH02 | 110 | 140 | |
HT | TH04 | 110 | 140 | |
1/2 HM | TM02 | 95.0 | 120 | |
HM | TM04 | 110 | 135 |