Overview
Physical Properties
Hard
Available Platings | Ag, Ni, Sn |
Elongation | 1% |
Tensile | 125 ksi |
Electrical Conductivity | 11% IACS @ 68 °F |
Electrical Resistivity | 94.3 Ω-cmil/ft @ 68 ºF |
Density | 0.321 lb/in³ |
Coefficient of Thermal Resistance | 0.00033 per °F |
Melting Point (Solidus) | 1,940 °F |
Melting Point (Liquidus) | 2,065 °F |
Available Platings | Ag, Ni, Sn |
Elongation | 1% |
Tensile | 862 Mpa |
Electrical Conductivity | 0.064 MS·cm @ 20 °C |
Electrical Resistivity | 15.67 μΩ-cm @ 20 ºC |
Density | 8.89 gm/cm³ |
Coefficient of Thermal Resistance | 0.00059 per °C |
Melting Point (Solidus) | 1,060 °C |
Melting Point (Liquidus) | 1,129 °C |