C17510 Copper-Nickel-Beryllium Alloy Wire (CuNi2Be)

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As a low beryllium alloy, C17510 resides at the lower strength end of the beryllium copper strength spectrum but in comparison has a substantial increase in electrical conductivity. The alloy processes and heat treats like all beryllium coppers and can also be provided in a (HM) “Mill Hardened” temper.

Mechanical Properties

Round Wire

TEMPER NAME  TEMPER CODE  TENSILE STRENGTH (N/mm²) MILL LIMITS 
MIN MAX
Annealed TB00 240 380 .0254 - 3.264 mm
Hard TD04 450 550
AT TF00 690 895
HT TH04 760 965

Square Wire

TEMPER NAME  TEMPER CODE  TENSILE STRENGTH (N/mm²) MILL LIMITS 
MIN MAX
Annealed TB00 240 380 .2540 - 1.905 mm
Hard TD04 450 550
AT TF00 690 895
HT TH04 760 965

Rolled Flat

TEMPER NAME TEMPER CODE TENSILE STRENGTH (N/mm²) MILL LIMITS 
MIN MAX
Annealed TB00 240 380

Thickness: 
.2540 - 1.905 mm

Width: 
.3810 - 6.350 mm 

1/4 Hard TD02 415 520
Hard TD04 480 585
AT TF00 690 895
1/2 AT TH02 760 965
HT TH04 760 965
1/2 HM TM02 655 825
HM TM04 760 930

Physical Properties

Melting Point (Liquidis) 1068°C
Melting Point (Solidus) 1029°C
Minimum Solutionizing Temperature 1550°C
Density 8.7746 gm/cu cm
Electrical Resistivity (Annealed) 3.79033 ?? -cm @ 20°C
Electrical Conductivity (Rolled or Drawn) 0.281 MegaSiemens /cm @ 20°C
Electrical Conductivity (Age Hardedned) 0.2634 MegaSiemens /cm @ 20°C
Thermal Conductivity (Solutionized-Aged) 207.789 W/m · °K @ 20°C
Coefficient of Thermal Expansion 0.00001764°C (20-300°C)
Modulus of Elasticity (Tension) 132400 MPa
Modulus of Rigidity 51700 MPa

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