C725 Copper-Nickel-Tin Alloy Wire (CuNi9Sn2)
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Alloy C725 is a moderate strength, low conductivity alloy with excellent bare solderability and corrosion resistance. Applications include electronic parts, springs, connectors and wire wrap terminals.
Mechanical Properties
Round Wire
| Temper Name | Temper Code | Tensile Strength (N/mm²) | Mill Limits | |
| Min | Max | |||
| Annealed | 380 | 450 | .0254 - 3.264 mm | |
| 1/4 Hard | H01 | 450 | 550 | |
| 1/2 Hard | H02 | 515 | 620 | |
| 3/4 Hard | H03 | 550 | 655 | |
| Hard | H04 | 655 | 760 | |
| Spring | H08 | 760 | 860 | |
Square Wire
| Temper Name | Temper Code | Tensile Strength (N/mm²) | Mill Limits | |
| Min | Max | |||
| Annealed | 380 | 450 | .2540 - 1.905 mm | |
| 1/4 Hard | H01 | 450 | 550 | |
| 1/2 Hard | H02 | 515 | 620 | |
| 3/4 Hard | H03 | 550 | 655 | |
| Hard | H04 | 655 | 760 | |
| Spring | H08 | 760 | 860 | |
Rolled Flat
| Temper Name | Temper Code | Tensile Strength (N/mm²) | Mill Limits | |
| Min | Max | |||
| Annealed | 310 | 450 |
Thickness: Width: |
|
| 1/4 Hard | H01 | 380 | 515 | |
| 1/2 Hard | H02 | 450 | 550 | |
| Hard | H04 | 515 | 620 | |
| Extra Hard | H06 | 550 | 655 | |
| Spring | H08 | 585 | 690 | |
Physical Properties
| Melting Point (Liquidis) | 1129°C |
| Melting Point (Solidus) | 1060°C |
| Density | 8.88536 gm/cu cm |
| Electrical Resistivity (Annealed) | 15.6767 ?? -cm @ 20°C |
| Electrical Conductivity (Annealed) | 0.0644 MegaSiemens /cm @ 20°C |
| Thermal Conductivity (Solutionized-Aged) | 53.67894737 W/m · °K @ 20°C |
| Coefficient of Thermal Expansion | 0.00001656°C (20-300°C) |
| Modulus of Elasticity (Tension) | 137900 MPa |
| Modulus of Rigidity | 51700 MPa |
For a full size version of product specifications, including chemical composition in both US and Metric units, please download the PDF.