C725 Copper-Nickel-Tin Alloy Wire (CuNi9Sn2)

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Alloy C725 is a moderate strength, low conductivity alloy with excellent bare solderability and corrosion resistance. Applications include electronic parts, springs, connectors and wire wrap terminals.

Mechanical Properties

Round Wire

Temper Name  Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
Annealed   380 450 .0254 - 3.264 mm
1/4 Hard H01 450 550
1/2 Hard H02 515 620
3/4 Hard H03 550 655
Hard H04 655 760
Spring H08 760 860

Square Wire

Temper Name  Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
Annealed   380 450 .2540 - 1.905 mm
1/4 Hard H01 450 550
1/2 Hard H02 515 620
3/4 Hard H03 550 655
Hard H04 655 760
Spring H08 760 860

Rolled Flat

Temper Name  Temper Code  Tensile Strength (N/mm²) Mill Limits 
Min Max
Annealed   310 450

Thickness:
.2540 - 1.905 mm

Width:
.3810 - 6.350 mm

1/4 Hard H01 380 515
1/2 Hard H02 450 550
Hard H04 515 620
Extra Hard H06 550 655
Spring H08 585 690

Physical Properties

Melting Point (Liquidis) 1129°C
Melting Point (Solidus) 1060°C
Density 8.88536 gm/cu cm
Electrical Resistivity (Annealed) 15.6767 ?? -cm @ 20°C
Electrical Conductivity (Annealed) 0.0644 MegaSiemens /cm @ 20°C
Thermal Conductivity (Solutionized-Aged) 53.67894737 W/m · °K @ 20°C
Coefficient of Thermal Expansion 0.00001656°C (20-300°C)
Modulus of Elasticity (Tension) 137900 MPa
Modulus of Rigidity 51700 MPa

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