Alloy C194 is a first generation high performance alloy used worldwide. C194 combines good electrical conductivity with high tensile strength, good solderability and plateability. Applications include connectors, semiconductor pins and leadframes, sockets and mass terminations.
Mechanical Properties
Round Wire
Annealed |
|
40 |
58 |
.0010 - .1285 inch |
1/4 Hard |
H01 |
50 |
65 |
1/2 Hard |
H02 |
60 |
75 |
Hard |
H04 |
70 |
85 |
Extra Hard |
H06 |
80 |
95 |
Spring |
H08 |
90 |
|
Square Wire
Annealed |
|
40 |
58 |
.0100 - .0808 inch |
1/4 Hard |
H01 |
50 |
65 |
1/2 Hard |
H02 |
60 |
75 |
Hard |
H04 |
70 |
85 |
Extra Hard |
H06 |
80 |
95 |
Spring |
H08 |
90 |
|
Rolled Flat
Annealed |
|
40 |
63 |
Thickness:
.0100 - .0500 inch
Width:
.0150 - .2500 inch
|
1/2 Hard |
H02 |
53 |
63 |
Hard |
H04 |
60 |
70 |
Extra Hard |
H06 |
67 |
73 |
Spring |
H08 |
70 |
76 |
Extra Spring |
H10 |
73 |
80 |
Physical Properties
Melting Point (Liquidis) |
1990°F |
Melting Point (Solidus) |
1980°F |
Density |
0.322 lbs/cu in |
Electrical Resistivity (Annealed) |
15 Ω⋅cmil/ft @ 68°F |
Electrical Conductivity (Annealed) |
65% IACS @ 68°F |
Thermal Conductivity (Solutionized-Aged) |
150 Btu ft/sq ft hr °F @ 68°F |
Coefficient of Thermal Expansion |
0.0000098°F (68-572°F) |
Modulus of Elasticity (Tension) |
17500 ksi |
Modulus of Rigidity |
6600 ksi |
Mechanical Properties
Round Wire
Annealed |
|
275 |
400 |
.0254 - 3.264 mm |
1/4 Hard |
H01 |
345 |
450 |
1/2 Hard |
H02 |
415 |
515 |
Hard |
H04 |
485 |
585 |
Extra Hard |
H06 |
550 |
655 |
Spring |
H08 |
620 |
0 |
Square Wire
Annealed |
|
275 |
400 |
.2540 - 1.905 mm |
1/4 Hard |
H01 |
345 |
450 |
1/2 Hard |
H02 |
415 |
515 |
Hard |
H04 |
485 |
585 |
Extra Hard |
H06 |
550 |
655 |
Spring |
H08 |
620 |
0 |
Rolled Flat
Annealed |
|
275 |
435 |
Thickness:
.2540 - 1.905 mm
Width:
.3810 - 6.350 mm
|
1/2 Hard |
H02 |
365 |
435 |
Hard |
H04 |
415 |
485 |
Extra Hard |
H06 |
460 |
505 |
Spring |
H08 |
485 |
525 |
Extra Spring |
H10 |
505 |
550 |
Physical Properties
Melting Point (Liquidis) |
1088°C |
Melting Point (Solidus) |
1082°C |
Density |
8.91304 gm/cu cm |
Electrical Resistivity (Annealed) |
2.4936 ?? -cm @ 20°C |
Electrical Conductivity (Annealed) |
0.38052 MegaSiemens /cm @ 20°C |
Thermal Conductivity (Solutionized-Aged) |
259.7368421 W/m · °K @ 20°C |
Coefficient of Thermal Expansion |
0.00001764°C (20-300°C) |
Modulus of Elasticity (Tension) |
120700 MPa |
Modulus of Rigidity |
45500 MPa |