C172 Beryllium Copper Alloy Wire (CuBe2)

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Beryllium Copper alloys combine form-ability with very high strength properties when aged. Applications are in springs, connectors, switches and automotive parts. Special heat treating of the wire at the mill produces a “Mill Hardened” (HM) tempered Beryllium Copper wire which can then be formed and used without additional heat treatment.

English UnitsMetric Units

Mechanical Properties

Round Wire

Temper Name  Temper Code  Tensile Strength (ksi) Mill Limits 
Min Max
Annealed (A) TB00 58 78 .0010 - .1285 inch
1/4 Hard TD01 90 115
1/2 Hard TD02 110 135
3/4 Hard TD03 130 155
Hard TD04 140 165
AT TF00 160 200
1/4 HT TH01 175 210
1/2 HT TH02 185 215
3/4 HT TH03 190 230
HT TH04 195 230

Square Wire

Temper Name  Temper Code  Tensile Strength (ksi) Mill Limits 
Min Max
Annealed (A) TB00 58 78 .0100 - .0808 inch
1/4 Hard TD01 90 115
1/2 Hard TD02 110 135
3/4 Hard TD03 130 155
Hard TD04 140 165
AT TF00 160 200
1/4 HT TH01 175 210
1/2 HT TH02 185 215
3/4 HT TH03 190 230
HT TH04 195 230

Rolled Flat

Temper Name  Temper Code  Tensile Strength (ksi) Mill Limits 
Min Max
Annealed (A) TB00 60 78

Thickness:
.0100 - .0500 inch

Width:
.0150 - .2500 inch
1/4 Hard TD01 75 88
1/2 Hard TD02 85 100
Hard TD03 100 130
AT TF00 165 195
1/4 HT TH01 175 205
1/2 HT TH02 185 215
HT TH03 190 220

Physical Properties

(1) Expressed as a range per CDA
Melting Point (Liquidis) 1800°F
Melting Point (Solidus) 1590°F
Minimum Solutionizing Temperature 1450°F
Density 0.298 lbs/cu in
Electrical Resistivity (Annealed) 46.2 Ω⋅cmil/ft @ 68°F
Electrical Conductivity (Age Hardedned) 22% IACS @ 68°F
Thermal Conductivity (Solutionized-Aged) (1) 62-75 Btu ft/sq ft hr °F @ 68°F
Coefficient of Thermal Expansion 0.0000099°F (68-572°F)
Modulus of Elasticity (Tension) 18500 ksi
Modulus of Rigidity 7300 ksi

For a full size version of product specifications, including chemical composition in both US and Metric units, please download the PDF.