Beryllium Copper alloys combine form-ability with very high strength properties when aged. Applications are in springs, connectors, switches and automotive parts. Special heat treating of the wire at the mill produces a “Mill Hardened” (HM) tempered Beryllium Copper wire which can then be formed and used without additional heat treatment.
Mechanical Properties
Round Wire
Annealed (A) |
TB00 |
58 |
78 |
.0010 - .1285 inch |
1/4 Hard |
TD01 |
90 |
115 |
1/2 Hard |
TD02 |
110 |
135 |
3/4 Hard |
TD03 |
130 |
155 |
Hard |
TD04 |
140 |
165 |
AT |
TF00 |
160 |
200 |
1/4 HT |
TH01 |
175 |
210 |
1/2 HT |
TH02 |
185 |
215 |
3/4 HT |
TH03 |
190 |
230 |
HT |
TH04 |
195 |
230 |
Square Wire
Annealed (A) |
TB00 |
58 |
78 |
.0100 - .0808 inch |
1/4 Hard |
TD01 |
90 |
115 |
1/2 Hard |
TD02 |
110 |
135 |
3/4 Hard |
TD03 |
130 |
155 |
Hard |
TD04 |
140 |
165 |
AT |
TF00 |
160 |
200 |
1/4 HT |
TH01 |
175 |
210 |
1/2 HT |
TH02 |
185 |
215 |
3/4 HT |
TH03 |
190 |
230 |
HT |
TH04 |
195 |
230 |
Rolled Flat
Annealed (A) |
TB00 |
60 |
78 |
Thickness:
.0100 - .0500 inch
Width:
.0150 - .2500 inch
|
1/4 Hard |
TD01 |
75 |
88 |
1/2 Hard |
TD02 |
85 |
100 |
Hard |
TD03 |
100 |
130 |
AT |
TF00 |
165 |
195 |
1/4 HT |
TH01 |
175 |
205 |
1/2 HT |
TH02 |
185 |
215 |
HT |
TH03 |
190 |
220 |
Physical Properties
(1) Expressed as a range per CDA |
Melting Point (Liquidis) |
1800°F |
Melting Point (Solidus) |
1590°F |
Minimum Solutionizing Temperature |
1450°F |
Density |
0.298 lbs/cu in |
Electrical Resistivity (Annealed) |
46.2 Ω⋅cmil/ft @ 68°F |
Electrical Conductivity (Age Hardedned) |
22% IACS @ 68°F |
Thermal Conductivity (Solutionized-Aged) |
(1) 62-75 Btu ft/sq ft hr °F @ 68°F |
Coefficient of Thermal Expansion |
0.0000099°F (68-572°F) |
Modulus of Elasticity (Tension) |
18500 ksi |
Modulus of Rigidity |
7300 ksi |
Mechanical Properties
Round Wire
Annealed (A) |
TB00 |
400 |
540 |
.0254 - 3.264 mm |
1/4 Hard |
TD01 |
620 |
795 |
1/2 Hard |
TD02 |
760 |
930 |
3/4 Hard |
TD03 |
895 |
1070 |
Hard |
TD04 |
965 |
1140 |
AT |
TF00 |
1105 |
1380 |
1/4 HT |
TH01 |
1205 |
1450 |
1/2 HT |
TH02 |
1275 |
1480 |
3/4 HT |
TH03 |
1310 |
1585 |
HT |
TH04 |
1345 |
1585 |
Square Wire
Annealed (A) |
TB00 |
400 |
540 |
.2540 - 1.905 mm |
1/4 Hard |
TD01 |
620 |
795 |
1/2 Hard |
TD02 |
760 |
930 |
3/4 Hard |
TD03 |
895 |
1070 |
Hard |
TD04 |
965 |
1140 |
AT |
TF00 |
1105 |
1380 |
1/4 HT |
TH01 |
1205 |
1450 |
1/2 HT |
TH02 |
1275 |
1480 |
3/4 HT |
TH03 |
1310 |
1585 |
HT |
TH04 |
1345 |
1585 |
Rolled Flat
Annealed (A) |
TB00 |
415 |
540 |
Thickness:
.2540 - 1.905 mm
Width:
.3810 - 6.350 mm
|
1/4 Hard |
TD01 |
515 |
605 |
1/2 Hard |
TD02 |
585 |
690 |
Hard |
TD03 |
690 |
895 |
AT |
TF00 |
1140 |
1345 |
1/4 HT |
TH01 |
1205 |
1415 |
1/2 HT |
TH02 |
1275 |
1480 |
HT |
TH03 |
1310 |
1515 |
Physical Properties
(1) Expressed as a range per CDA |
Melting Point (Liquidis) |
982°C |
Melting Point (Solidus) |
866°C |
Minimum Solutionizing Temperature |
788°C |
Density |
8.24871 gm/cu cm |
Electrical Resistivity (Annealed) |
7.6804 ?? -cm @ 20°C |
Electrical Conductivity (Age Hardedned) |
0.12879 MegaSiemens /cm @ 20°C |
Thermal Conductivity (Solutionized-Aged) |
(1) 107-130 W/m · °K @ 20°C |
Coefficient of Thermal Expansion |
0.00001782°C (20-300°C) |
Modulus of Elasticity (Tension) |
127600 Mpa |
Modulus of Rigidity |
50300 Mpa |
For a full size version of product specifications, including chemical composition in both US and Metric units, please download the PDF.