As a low beryllium alloy, C17510 resides at the lower strength end of the beryllium copper strength spectrum but in comparison has a substantial increase in electrical conductivity. The alloy processes and heat treats like all beryllium coppers and can also be provided in a (HM) “Mill Hardened” temper.
Mechanical Properties
Round Wire
Annealed |
TB00 |
35 |
240 |
.0010 - .1285 inch |
Hard |
TD04 |
65 |
450 |
AT |
TF00 |
100 |
690 |
HT |
TH04 |
110 |
760 |
Square Wire
Annealed |
TB00 |
35 |
240 |
.0100 - .0808 inch |
Hard |
TD04 |
65 |
450 |
AT |
TF00 |
100 |
690 |
HT |
TH04 |
110 |
760 |
Rolled Flat
Annealed |
TB00 |
35 |
55 |
Thickness:
.0100 - .0500 inch
Width:
.0150 - .2500 inch
|
1/4 Hard |
TD02 |
60 |
75 |
Hard |
TD04 |
70 |
85 |
AT |
TF00 |
100 |
130 |
1/2 AT |
TH02 |
110 |
140 |
HT |
TH04 |
110 |
140 |
1/2 HM |
TM02 |
95 |
120 |
HM |
TM04 |
110 |
135 |
Physical Properties
Melting Point (Liquidis) |
1955°F |
Melting Point (Solidus) |
1885°F |
Minimum Solutionizing Temperature |
1550°F |
Density |
0.317 lbs/cu in |
Electrical Resistivity (Annealed) |
22.8 Ω⋅cmil/ft @ 68°F |
Electrical Conductivity (Rolled or Drawn) |
48% IACS @ 68°F |
Electrical Conductivity (Age Hardedned) |
45% IACS @ 68°F |
Thermal Conductivity (Solutionized-Aged) |
120 Btu ft/sq ft hr °F @ 68°F |
Coefficient of Thermal Expansion |
0.0000098°F (68-572°F) |
Modulus of Elasticity (Tension) |
19200 ksi |
Modulus of Rigidity |
7500 ksi |
Mechanical Properties
Round Wire
Annealed |
TB00 |
240 |
380 |
.0254 - 3.264 mm |
Hard |
TD04 |
450 |
550 |
AT |
TF00 |
690 |
895 |
HT |
TH04 |
760 |
965 |
Square Wire
Annealed |
TB00 |
240 |
380 |
.2540 - 1.905 mm |
Hard |
TD04 |
450 |
550 |
AT |
TF00 |
690 |
895 |
HT |
TH04 |
760 |
965 |
Rolled Flat
Annealed |
TB00 |
240 |
380 |
Thickness:
.2540 - 1.905 mm
Width:
.3810 - 6.350 mm
|
1/4 Hard |
TD02 |
415 |
520 |
Hard |
TD04 |
480 |
585 |
AT |
TF00 |
690 |
895 |
1/2 AT |
TH02 |
760 |
965 |
HT |
TH04 |
760 |
965 |
1/2 HM |
TM02 |
655 |
825 |
HM |
TM04 |
760 |
930 |
Physical Properties
Melting Point (Liquidis) |
1068°C |
Melting Point (Solidus) |
1029°C |
Minimum Solutionizing Temperature |
1550°C |
Density |
8.7746 gm/cu cm |
Electrical Resistivity (Annealed) |
3.79033 ?? -cm @ 20°C |
Electrical Conductivity (Rolled or Drawn) |
0.281 MegaSiemens /cm @ 20°C |
Electrical Conductivity (Age Hardedned) |
0.2634 MegaSiemens /cm @ 20°C |
Thermal Conductivity (Solutionized-Aged) |
207.789 W/m · °K @ 20°C |
Coefficient of Thermal Expansion |
0.00001764°C (20-300°C) |
Modulus of Elasticity (Tension) |
132400 MPa |
Modulus of Rigidity |
51700 MPa |
For a full size version of product specifications, including chemical composition in both US and Metric units, please download the PDF.