Microshield

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Overview

Physical Properties

Hard

Available Platings Ag, Ni, Sn
Elongation 1%
Tensile 125 ksi
Electrical Conductivity 11% IACS @ 68 °F
Electrical Resistivity 94.3 Ω-cmil/ft @ 68 ºF
Density 0.321 lb/in³
Coefficient of Thermal Resistance 0.00033 per °F
Melting Point (Solidus) 1,940 °F
Melting Point (Liquidus) 2,065 °F
Available Platings Ag, Ni, Sn
Elongation 1%
Tensile 862 Mpa
Electrical Conductivity 0.064 MS·cm @ 20 °C
Electrical Resistivity 15.67 μΩ-cm @ 20 ºC
Density 8.89 gm/cm³
Coefficient of Thermal Resistance 0.00059 per °C
Melting Point (Solidus) 1,060 °C
Melting Point (Liquidus) 1,129 °C

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