C17510 Copper-Nickel-Beryllium Alloy Wire (CuNi2Be)
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As a low beryllium alloy, C17510 resides at the lower strength end of the beryllium copper strength spectrum but in comparison has a substantial increase in electrical conductivity. The alloy processes and heat treats like all beryllium coppers and can also be provided in a (HM) “Mill Hardened” temper.
Mechanical Properties
Round Wire
| TEMPER NAME | TEMPER CODE | TENSILE STRENGTH (N/mm²) | MILL LIMITS | |
| MIN | MAX | |||
| Annealed | TB00 | 240 | 380 | .0254 - 3.264 mm |
| Hard | TD04 | 450 | 550 | |
| AT | TF00 | 690 | 895 | |
| HT | TH04 | 760 | 965 | |
Square Wire
| TEMPER NAME | TEMPER CODE | TENSILE STRENGTH (N/mm²) | MILL LIMITS | |
| MIN | MAX | |||
| Annealed | TB00 | 240 | 380 | .2540 - 1.905 mm |
| Hard | TD04 | 450 | 550 | |
| AT | TF00 | 690 | 895 | |
| HT | TH04 | 760 | 965 | |
Rolled Flat
| TEMPER NAME | TEMPER CODE | TENSILE STRENGTH (N/mm²) | MILL LIMITS | |
| MIN | MAX | |||
| Annealed | TB00 | 240 | 380 |
Thickness: Width: |
| 1/4 Hard | TD02 | 415 | 520 | |
| Hard | TD04 | 480 | 585 | |
| AT | TF00 | 690 | 895 | |
| 1/2 AT | TH02 | 760 | 965 | |
| HT | TH04 | 760 | 965 | |
| 1/2 HM | TM02 | 655 | 825 | |
| HM | TM04 | 760 | 930 | |
Physical Properties
| Melting Point (Liquidis) | 1068°C |
| Melting Point (Solidus) | 1029°C |
| Minimum Solutionizing Temperature | 1550°C |
| Density | 8.7746 gm/cu cm |
| Electrical Resistivity (Annealed) | 3.79033 ?? -cm @ 20°C |
| Electrical Conductivity (Rolled or Drawn) | 0.281 MegaSiemens /cm @ 20°C |
| Electrical Conductivity (Age Hardedned) | 0.2634 MegaSiemens /cm @ 20°C |
| Thermal Conductivity (Solutionized-Aged) | 207.789 W/m · °K @ 20°C |
| Coefficient of Thermal Expansion | 0.00001764°C (20-300°C) |
| Modulus of Elasticity (Tension) | 132400 MPa |
| Modulus of Rigidity | 51700 MPa |
For a full size version of product specifications, including chemical composition in both US and Metric units, please download the PDF.